MediaTek showcased its active intelligent cockpit solution during the 19th Beijing International Automotive Exhibition. The company presented active intelligent cockpit, in-car entertainment, and in-car connectivity solutions together with ecosystem partners, all based on the Dimensity Auto platform.
“Dimensity Auto has gained widespread recognition from numerous automakers,” said Mike Chang, MediaTek Vice President and Auto Business General Manager. “As we work closely with our partners across the industry, we are pioneering the deep integration of intelligent AI into automotive cockpit chips; utilizing edge-cloud collaboration, dual AI engines, and improvements in intelligent AI inference efficiency, we are the first to create an active intelligent cockpit solution, transforming the cockpit from a passive tool into a third-space intelligent agent.”
The Dimensity Auto Cockpit Platform C-X1 is built on 3nm process technology and provides up to 400 TOPS of full-modal AI computing power. It features large model decoding optimization that reduces bandwidth demand for large models to 10%. The platform supports Multi-Process Service (MPS), allowing multiple large model task processes to share GPU computing units, with throughput increased by up to 50% during complex instruction execution.
The platform integrates the NVIDIA Blackwell GPU architecture and deep learning accelerators and supports the NVIDIA CUDA ecosystem. It includes the Dimensity AI development kit (NeuroPilot SDK) with optimization technologies, a visual development environment, and Model Hub resources. MediaTek collaborates with global vendors for model architecture adaptation and application deployment.
The MDAP Dimensity Cockpit Software Solution includes APIs for visual, voice, and emotion environmental sensing to enable millisecond-level perception and targeted services. It offers an edge-side Orchestrator for edge-cloud task collaboration and standard application protocols (MCP, SKILL) for integrating cloud services such as maps, social, communication, music, food, and payment.
MediaTek demonstrated an in-vehicle AAA gaming solution on the C-X1 platform using NVIDIA RTX GPU ray tracing and NVIDIA DLSS technology, supporting graphics rendering up to 4K@60FPS.
The company also demonstrated in-vehicle connectivity solutions based on Dimensity Auto Connectivity, including 5G-Advanced with 3GPP R18 support, NB-NTN and NR-NTN satellite communications, and dual Bluetooth. The platform is the first to support 5G-Advanced communication and features the world’s first automotive 3Tx DSDA capability for L3/L4 ADAS applications. It supports industry standard protocols for adaptation to local communication standards in global markets.
The platform aims to power Robotaxis and Robovans before the end of the year through collaboration with ecosystem partners. MediaTek plans to introduce next-generation Wi-Fi 8 technology in the future, with expected improvements including doubled data throughput, 50% reduced power consumption, and at least 25% reduced network latency compared to the previous generation.
MediaTek is preparing to launch a 2nm in-car cockpit chip in the near future. The company stated it will continue working with ecosystem partners to integrate high-performance AI, 5G, and satellite communications technologies.
