Indium Corporation assistant product manager Foo Siang Hooi will discuss factors affecting compressible metal thermal interface materials (TIMs) for next-generation cooling applications at TestConX China in Suzhou, China.
In a presentation titled “Beyond Thermal Conductivity: What Really Matters for Compressible Metal TIMs,” Hooi will examine installation time, applied pressure, material thickness, and pattern geometry. The presentation will show how plastic deformation, interfacial resistance, and surface conformity affect thermal resistance.
The session will provide guidance on optimizing TIM configurations and assembly conditions to improve thermal performance and long-term reliability in AI accelerators, data center hardware, and power electronics.
Hooi’s presentation is scheduled for October 29, 2026, at 13:30 CST.
