Kaynes Semicon, a subsidiary of Kaynes Technology, has scheduled the opening ceremony for its Outsourced Semiconductor Assembly and Test (OSAT) facility at the Sanand industrial area on March 31, 2026. The event will include the launch of the company’s Multi-Chip Module (MCM).
Prime Minister Narendra Modi is expected to attend the ceremony, along with Gujarat Chief Minister Bhupendrabhai Patel and Union Minister Ashwini Vaishnaw. The gathering marks the formal inauguration of the facility and the introduction of the MCM product.
The OSAT plant represents one of the approved projects under the India Semiconductor Mission (ISM 1.0). It carries a total investment of ₹3,307 crore. The facility focuses on semiconductor backend manufacturing, including assembly, testing, and system integration capabilities. Earlier pilot operations at the site enabled the shipment of India’s first commercially packaged Multi-Chip Modules to a U.S. customer in 2025.
According to the company announcement, the March 31 event will highlight progress in scalable production and advanced packaging at the Sanand site. The MCM launch forms part of the facility’s product introduction. No additional details on production volumes or timelines beyond the ceremony date were specified in the provided announcement.
The occasion is described by Kaynes Semicon as reflecting steps in semiconductor manufacturing and ecosystem development within the country. The company stated it contributes to backend manufacturing capabilities through this project.
