OKI Advances Photonics Integration with Tiling CFB Technology for 300 mm Silicon Wafers

OKI  has developed Tiling Crystal Film Bonding (CFB) technology, enabling the heterogeneous integration of small-diameter optical semiconductor wafers, such as 50 mm to 100 mm indium phosphide (InP) wafers, onto 300 mm silicon wafers. This addresses previous limitations due to wafer size disparities and supports the advancement of photonics-electronics convergence technology, which combines electronic and optical circuits for high-density, high-speed, and low-power data transmission.

The technology responds to the growing demand for data centers driven by artificial intelligence, where managing power consumption while enhancing processing capabilities is a critical challenge. Silicon photonics, which uses 200 mm or 300 mm silicon wafers, requires integration with smaller optical semiconductor wafers, typically limited by epitaxial growth constraints. Additionally, silicon optical waveguides demand nanoscale roughness control, necessitating damage-free integration processes.

OKI’s Tiling CFB technology facilitates 52 repeated tiling operations across a 300 mm silicon wafer using a single 2-inch InP wafer, ensuring efficient material use. The InP wafer can be reused post-transfer, reducing environmental impact. The process achieves a placement accuracy of ±1 μm and an angular accuracy of ±0.005°, enhanced by OKI’s 3D intersec...