High Density Packaging User Group (HDP) and Global Electronics Association have released IPC-TM-650-2.2.23, a new copper profile test method based on results from HDP’s Non-Contact Copper Foil Profile project.
“This is a significant development as it relates to high-speed, high-performance applications where lower profile copper roughness is necessary,” said Larry Marcanti, Executive Director of HDP User Group.
Matt Kelly, CTO, VP Technology Solutions at Global Electronics Association, said HDP’s work provided the empirical data necessary to create the test method. He said the organizations would continue and grow their collaboration to ensure standards and test methods keep pace with technology developments and are backed by strong technical data.
