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Qnity Showcases Materials Innovation Powering Electronics Next Leap at TPCA Show 2026

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Qnity Electronics will showcase its materials portfolio at the TPCA Show, taking place October 20-22 at the Taipei Nangang Exhibition Center. Through advanced materials and end-to-end solutions, the company plans to demonstrate how its technology is enabling AI through innovations in advanced packaging, interconnects, and thermal management, aimed at supporting higher-performance, more energy-efficient AI systems.

Chuck Xu, president of Interconnect Solutions at Qnity, said AI is pushing printed circuit boards to their limits, requiring more power, generating more heat, and demanding denser interconnects within increasingly complex designs. He said those challenges are ultimately solved at the materials level, and that at TPCA Show and the IMPACT Conference, Qnity will show how its plating chemistry, circuit imaging, flexible circuit materials, and thermal management solutions help customers build AI systems that are faster, more reliable, and more resource-efficient, working side by side with customers as a co-innovator.

At the event, Qnity experts will share how the company's materials innovation supports advanced connectivity and improved thermal efficiency for AI, high-performance computing, and data-intensive applications through several sessions.

On October 20, from 10:10 a.m. to 12:10 p.m., Qnity will hold a dedicated session at the IMPACT Conference Taiwan titled "Enable Energy-Efficient AI Technologies Through Integrated Material Solutions." The session will explore how integrated material and process innovations can improve the performance, energy efficiency, and reliability of next-generation AI systems, with Qnity experts sharing insights into advanced copper metallization technology for AI-driven high-density interconnects, as well as thermal management solutions for the thin, high-power PCBs used in AI data centers.

On October 21, from 11:10 to 11:25 a.m., Qnity R&D leader Jason Chang will present "High-speed AI and Data Center PCB Technology," outlining advanced metallization solutions for next-generation AI and high-performance computing PCBs.

Also on October 21, from 1:30 to 3:00 p.m., an "AI-Driven Global Strategy and Market Trends" session will bring together industry leaders to discuss the evolving AI landscape and its impact on global markets. Chuck Xu will participate as a panelist, discussing these topics with value chain partners from PCB fabricators and equipment suppliers.

Qnity has a longstanding presence in Taiwan, with approximately 1,500 team members across technical centers, R&D labs, and manufacturing facilities in the region. The company notes its products have powered advances in electronics for 50 years.

Customers and partners are invited to meet with Qnity engineers and scientists at Booth L213 on the fourth floor of TaiNEX 1 to explore solutions supporting the next generation of AI technology.

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EEHerald News Desk

Editor, Electronics Engineering Herald


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