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Call for Participation Opens for Advanced Electronic Packaging Conference AEPC 2027 at APEX EXPO

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The Call for Participation is now open for the Advanced Electronic Packaging Conference (AEPC) 2027 – Component-to-System-Level Integration, taking place during APEX EXPO 2027 in Anaheim, California.

AEPC is the electronics industry’s premier technical conference focused on component-to-system-level integration, advanced PCB and assembly manufacturing, and next-generation electronics technologies. The Global Electronics Association is inviting engineers, researchers, manufacturers, and technology leaders worldwide to submit technical presentation abstracts for the event.

The conference brings together participants across the electronics ecosystem to share peer-reviewed technical content, practical solutions, and emerging technologies in electronics design, materials, assembly and test, reliability, manufacturing, and system integration.

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Presenting at AEPC 2027 provides speakers with the opportunity to showcase their work to a global audience of engineers, researchers, manufacturers, and technology decision-makers. Selected speakers receive industry recognition, peer feedback, new professional connections, and the chance to contribute to the direction of electronics packaging, manufacturing, and system integration.

AEPC 2026 attracted more than 170 conference participants from 20 countries and featured 78 peer-reviewed technical papers from over 100 companies, universities, and research organizations.

The Association is seeking submissions for:
- Technical Presentations demonstrating innovation, practical application, and measurable industry impact
- Technical Posters showcasing emerging research and applied solutions
- Professional Development Courses advancing industry knowledge and skills

Submissions are encouraged across electronics design, materials, assembly and test, reliability, manufacturing, and system integration.

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Submission Deadlines 
Technical Presentations: September 18, 2026  
Professional Development Courses: September 18, 2026  
Technical Posters: December 4, 2026

"AEPC 2027 offers an unparalleled opportunity to contribute to the advancement of electronics technology and manufacturing," said Matt Kelly, Conference General Chair and CTO, VP, standards and technology solutions at the Global Electronics Association. "We invite innovators from around the world to share their work and help shape the future of our industry."

Prospective participants can view conference technical topics and submission requirements and submit proposals at https://www.apexexpo.org/event-info/call-participation.

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Srinivasa Reddy N

Editor, Electronics Engineering Herald


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