eSilicon adds packaging services to its online multi-project wafer quote system

eSilicon, a semiconductor company supporting first-time-right ASICs and ASSPs manufacturing for fables companies has announced the addition of package services to its automated, instant online quote system for multi-project wafer (MPW) shuttles. The service, accessed through user-friendly web or smartphone interfaces, instantly generates executable MPW quotes, saving time for its customers. MPW package options available online include: Wirebond Leadframe QFN 4mm x 4mm – 12mm x 12mm QFP 10mm x 10mm – 14mm x 14mm Wirebond BGA TFBGA 4mm x 4mm – 18mm x 18mm PBGA 17mm x 17mm – 35mm x 35mm Flip Chip BGA: FCBGA 12mm x 12mm – 35mm x 35mm "The online MPW tool is easy to use and we received our quote very quickly. Short feedback cycles are particularly important during the early decision-making phase as we iterate a design," said Andrea Colognese, Canova Tech's business development manager. "Receiving samples packaged by a quality supply chain will save a lot of effort and allow us to minimize risk and demonstrate results in a shorter timeframe. We are developing a solution for the new USB Power Delivery standard and our customers would like to see samples as quickly as possible. The automated MPW tool streamlined the process for us." "eSilicon is changing the way people work. Our online MPW quote tool democratizes the ASIC design process so our customers — no matter...