TDK Corporation announced the FS3303, the first model in a major expansion of its micro POL family of ultra-compact, non-isolated DC-DC power modules. The FS3303 has a footprint of 2.5 × 2.5 mm and a height of 1.2 mm. It delivers 3 A output current at ambient temperatures up to +90 °C, and up to +125 °C with derating. The module achieves peak efficiency of around 95%. It supports input voltages from 2.7 V to 6 V and output voltages from 0.4 V to 3.3 V, making it suitable for powering ASICs, SoCs, DSPs, and AI chipsets in space-constrained designs.
The FS3303 integrates the controller, driver, MOSFETs, and power inductor using TDK’s 3D chip-embedded packaging technology. This integration minimizes external components and provides board space savings for high-density power applications in optical modules and AI edge systems.
The broader micro POL portfolio expansion will include models spanning 3 A to 80 A output current across 0.3 V to 3.3 V rails, with package heights between 1.2 mm and 1.7 mm. These modules target optical networking applications scaling from 10 Gbit/s to 1.6 Tbit/s and AI accelerator platforms.
The FS3303-0400-AL is in full production and available for sampling at major distributors.
