TDK Corporation has expanded its NTCSP series of negative temperature coefficient (NTC) thermistors to support operation in high-temperature environments up to +175 °C. Mass production of the updated series began in February 2026. The expansion addresses requirements for electronic components in automotive power modules, where more powerful and heat-resistant power semiconductors generate higher temperatures. Previous TDK products in the series were limited to a maximum guaranteed operating temperature of +150 °C.
The new thermistors feature AgPd (silver-palladium) terminals compatible with conductive-glue mounting, which enables reliable performance at +175 °C—a level difficult to achieve with conventional solder mounting. These devices are AEC-Q200 compliant for automotive-grade reliability and offer an operating temperature range of -55 °C to +175 °C. They support temperature detection and temperature compensation in applications spanning low to high temperature ranges. Suitable automotive uses include anti-lock braking systems (ABS), transmissions, and engines. The NTCSP series includes 10 kΩ and 100 kΩ types in a 1.6 x 0.8 mm package.
Specific models are:
NTCSP163JF103FT1H: 1.6 x 0.8 x 0.8 mm, 10 kΩ at 25 °C, resistance tolerance 1%, B constant (B25/85) 3435 K, B constant tolerance 1%.
NTCSP164KF104FT1H: 100 kΩ at 25 °C, resistance tolerance 1%, B constant (B25/85) 4485 K, B constant tolerance 1%.
TDK stated it will continue developing NTC thermistors, including expansions in chip sizes, thermistor characteristics, and operating temperature ranges.
