CES 2026: Intel Launches Core Ultra Series 3 AI PC Processors made on Advanced 18A Semiconductor Node

Intel unveiled the Intel Core Ultra Series 3 processors at CES 2026, marking the first AI PC platform built on the Intel 18A process technology, designed and manufactured in the United States. Intel 18A uses most advanced semicondcutor equipment in the world to make most dense PC CPU semiconductor chips in the world.

Pic: Core Ultra chip

Pic: Wafer made using Intel 18 A process

The Series 3 processors power over 200 PC designs from global partners. At the launch event, Intel presented 9 demos covering gaming, AI, content creation, retail, and edge applications, all running on systems equipped with these processors.

Jim Johnson, Senior Vice President and General Manager of Intel's Client Computing Group, stated: “With Series 3, we are laser focused on improving power efficiency, adding more CPU performance, a bigger GPU in a class of its own, more AI compute and app compatibility you can count on with x86.”

The mobile lineup includes a new class of Intel Core Ultra X9 and X7 processors with integrated Intel Arc graphics, targeted at workloads in gaming, creation,...