Lam Research Unveils VECTOR TEOS 3D to Tackle 3D Chip Packaging Challenges for AI and HPC

Lam Research  introduced the VECTOR TEOS 3D, a deposition tool designed for advanced packaging of chips used in artificial intelligence (AI) and high-performance computing (HPC). The tool addresses challenges in 3D stacking and high-density heterogeneous integration by providing ultra-thick, uniform, inter-die gapfill. It incorporates a proprietary bowed wafer handling approach, dielectric deposition innovations, and Lam Equipment Intelligence technology for enhanced monitoring. The tool is currently installed at leading logic and memory fabrication facilities worldwide.

The VECTOR TEOS 3D deposits dielectric films up to 60 microns thick, with scalability to exceed 100 microns, offering structural, thermal, and mechanical support to prevent packaging failures like delamination. It is the first tool to enable single-pass processing of crack-free films over 30 microns thick, improving yield and process efficiency. The tool’s quad station module (QSM) architecture supports parallel processing, achieving nearly 70% faster throughput and up to 20% better cost of ownership compared to previous gapfill solutions. It also includes high-efficiency RF generators and ECO Mode for reduced energy consumption.

The tool handles high-bow wafers with precision, using novel clamping technology and an optimized pedestal design to ensure stability and uniform film depos...