Teledyne HiRel Semiconductors announced the release of the TDD416Y12NEPBM01, a 16 GByte DDR4-3200 memory module designed for aerospace and defense applications. This Enhanced Product (EP) module, rated for operation from –40°C to +105°C, is engineered for embedded platforms requiring high-speed memory in compact enclosures.
The TDD416Y12NEPBM01, a 216-ball BGA measuring 22mm x 22mm, integrates memory, termination, and passives into a single module, reducing the footprint compared to traditional SODIMMs. It supports error correction through an optional companion ECC, offering thermal isolation, design flexibility, and cost savings. The module provides clean signal integrity and thermal flexibility, making it suitable for use with processors supporting x64 or x72 memory buses, such as Xilinx Versal, Microchip PolarFire, NXP Layerscape, Xilinx Ultrascale+, Intel Atom, Teledyne’s LS1046-Space, and various ARM-based compute cores.
Compared to traditional SODIMMs, the module delivers 42% power savings, 42% jitter reduction, and 39% peak-to-peak savings. Its socketless, self-contained design simplifies layout complexity and reduces the bill of materials, addressing the needs of systems with limited board space.
Mont Taylor, Vice President of Business Development at Teledyne HiRel, stated that the module allows customers to tailor reliability to specific mission profiles, making it suitable for mixed deployments due to its versatility and compact design. Further details are available on the Teledyne HiRel Semiconductors website.
