Siemens Digital Industries Software announced two new additions to its Electronic Design Automation (EDA) portfolio on June 30, 2025: the Innovator3D IC solution suite and Calibre 3DStress software. These solutions address the complexities of designing and manufacturing 2.5D and 3D Integrated Circuit (IC) designs.
The Innovator3D IC solution suite enables IC designers to author, simulate, and manage heterogeneously integrated 2.5D/3D IC designs. It includes the Innovator3D IC Integrator for creating a digital twin with a unified data model for design planning, prototyping, and predictive analysis; the Innovator3D IC Layout for package interposer and substrate implementation; the Innovator3D IC Protocol Analyzer for chiplet-to-chiplet and die-to-die interface compliance analysis; and the Innovator3D IC Data Management solution for managing designs and design data IP. The suite uses an AI-infused user experience with multithreading and multicore capabilities to handle designs with over 5 million pins.
Calibre 3DStress provides thermo-mechanical analysis to assess the electrical impact of stress at the transistor level in 2.5D/3D IC architectures. It evaluates chip-package interactions throughout the design process, addressing issues caused by thinner dies and higher package processing temperatures, which can affect post-packaging performance. Building on the 2024 launch of Calibre 3DThermal, Calibre 3DStress integrates Calibre physical verification with a mechanical solver to analyze stresses in IC structures and materials, enabling early detection of potential electrical failures.
Mike Ellow, CEO of Siemens EDA, stated that these solutions help customers manage the complexities and risks of 3D IC designs, supporting faster design cycles. Customer feedback includes Chipletz, which uses the Innovator3D IC suite for AI and HPC datacenter solutions, and STMicroelectronics, which employs Calibre 3DStress for early design planning, sign-off flows, and IP-level stress analysis to improve reliability and reduce time to market.
More information on Siemens’ solutions for 2.5D/3D IC architectures.
