Asahi Kasei introduces TA series sunfort dry film photoresist for advanced semiconductor packaging

Asahi Kasei has launched the TA Series of Sunfort dry film photoresist, designed for advanced semiconductor packaging used in AI servers, automotive, and IoT applications. The product targets the growing market for next-generation chip packaging within Asahi Kasei’s Material sector. It offers ultra-high resolution for conventional stepper exposure and laser direct imaging (LDI) systems, enabling precise circuit pattern transfer in back-end processes.

The TA Series supports fine wiring formation in panel-level packages, achieving a resist width of 1.0 µm in a 4 µm pitch design for redistribution layer (RDL) formation using LDI exposure. It enables a 3 µm wide plating pattern through a semi-additive process (SAP) after resist stripping. Compared to liquid resist, traditionally used for RDL due to its resolution, dry film photoresist simplifies handling and processing on both sides of substrates in panel-level applications, though it previously faced resolution limitations.
Developed through customer collaboration, the TA Series addresses semiconductor packaging needs in AI, aut...