ADVERTISEMENT
Advertisement
Sensors

Murata introduces resin-molded NTC thermistor with wire-bonding for automotive applications

Listen to this story

AI NARRATED
0:00 / 0:00

Murata Manufacturing Co., Ltd. announced the launch of the FTI Series (FTN21XH502F0SRU), an NTC thermistor designed for automotive thermal management. The thermistor combines a resin-molded structure with wire-bonding compatibility, allowing installation directly on printed circuit boards (PCBs) near power semiconductor components in applications such as electric vehicle (EV) inverters and DC-DC converters.


The design eliminates the need for dedicated sensor mounting pads, enabling more compact PCB layouts. The thermistor operates reliably up to 175°C, using Murata’s external electrode bonding technology, suitable for high-temperature environments in automotive powertrains. It provides precise temperature measurement near semiconductor devices, reducing temperature margins and allowing for smaller chip sizes or fewer chips in parallel, which can lower module size and costs.
The FTI Series is available in a 2012 mm (0805-inch) package, with a resistance at 25°C of 5 kΩ ± 1% and a B-constant (25°C/50°C) of 3380 K ± 1%. Murata plans to expand the series with additional resistance values and variations, including silver sintering-compatible models alongside solder-mounted types.
Munenori Hikita, Director of Functional Devices Division at Murata, stated that the FTI Series supports EV technology and the automotive industry through ongoing product development. For inquiries or samples, visit Murata’s website.


More from Sensors