MacDermid announces the launch of MacuSpec VF-TH 500. This high-performance via filling and simultaneous through hole acid copper electroplating process is designed to enhance the reliability of complex, High Density Interconnect Printed Circuit Boards for next-generation technologies.
MacuSpec VF-TH 500 is engineered for HDI boards requiring simultaneous via filling and through hole plating with excellent microdistribution for panel plating and modified Semi-Additive Processing pattern plating. The chemistry delivers high via filling performance for via sizes up to 200 x 100 µm, ensuring a reliable deposit and improved throwing power at the knee and through hole.
This advanced chemistry enables more complex board designs in applications such as mSAP, high-reliability automotive, and high-performance computing.
“To meet the reliability and performance requirements for high-density interconnects, fabricators are often faced with challenges associated with large vias and complex via structures,” comments Dr. Kesheng Feng, Director of Metallization Research at MacDermid Alpha. “MacuSpec VF-TH 500 delivers outstanding results for mSAP with minimal copper addition to the surface. This enhances line/space reduction, boosts circuit density, and improves signal transmission. The process is highly versatile, meeting the needs of advanced fabricators.”
MacuSpec VF-TH 500 offers fabricators the following process benefits:
Compatibility with VCP or vertical hoist equipment.
Flexible options for both insoluble and soluble anode systems.
Seamless integration with direct metallization or electroless copper, ensuring reliable microvias with epitaxial growth across the interface.
