Aehr Test Systems announced it has completed shipment of its first high-throughpu FOX-XP semiconductor wafer level burn-in system for an AI chip customer, delivering its high-power FOX-XP system and multiple proprietary WaferPak Contactors for production wafer level test and burn-in of advanced AI processor chips.
Calling this technology a breakthrough Aehr said in its release "This latest turnkey solution, featuring the FOX-XP multi-wafer test and burn-in system with proprietary WaferPak full wafer Contactors, delivers thousands of watts of power and precise thermal control per wafer while testing and monitoring the device functionality"
The new system enables cost-effective production test and burn-in of high-power devices such as AI accelerators at wafer level temperatures of up to 150 degrees Celsius so that it can be identified and eliminated early life failures during wafer level production to save manufacturing cost and rise yield.
Gayn Erickson, President and CEO of Aehr Test Systems, commented:
“We are pleased to have collaborated with the customer on completing initial wafer production testing and to have shipped within Aehr’s fiscal third quarter as planned the initial volume production solution that is testing nine wafers in parallel on our new high-power FOX-XP system."
“Delivering the industry’s first wafer level burn-in solution for the AI processor market marks a major milestone for Aehr, opening a significant new market opportunity for our FOX-XP wafer level test and burn-in systems. Our high-power FOX-XP multi-wafer system and proprietary WaferPak Contactor offer a scalable, cost-effective manufacturing solution for testing and burn-in of AI processors at wafer level, eliminating the need for more expensive system-level burn-in."
“With this solution, we now offer customers the flexibility of production wafer level burn-in for their AI processors and accelerators, complementing our Sonoma ultra-high-power system for package part burn in, which we are shipping in volume to many manufacturers worldwide. Aehr Test Systems is the only company in the world that provides both wafer level and package level turnkey test and burn-in solutions for the AI processor market.”
Aehr offers FOX-XP and FOX-NP systems featuring multiple WaferPak Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations can do functional test and burn-in/cycling of semiconductor devices such as artificial intelligence processors and accelerators, silicon carbide and gallium nitride power semiconductors, silicon photonics and also any such optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
Source: Aehr Test Systems
