Renesas announced immediate availability of 80-MHz Arm Cortex M33 processor based low power MCUs delivering 168 µA/MHz active mode @ 80 MHz and standby current of 1.70 µA with all the SRAM retained. The new RA4L1 microcontroller (MCU) group feature advanced security with TrustZone support and segment LCD support. This new family joins another low power MCUs offering from Renesas called RA2L1.
They are made available in small packages including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), addressing the needs of products such as portable printers, digital cameras and smart labels.
These RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. The FSP eases migration of existing IP to and from either RA6 or RA2 Series devices.
“Renesas’ RA2L1 Group MCUs have seen remarkable market success since their launch in 2020, addressing a diverse range of low-power applications requiring capacitive touch. Built on the same low-power technology, the RA4L1 Group is our response to customers who require the unique combination of ultra-low power with better CPU performance, segment LCD support and advanced security,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas.
Key Features of the RA4L1 MCUs
Core: 80 MHz Arm Cortex-M33 with TrustZone
Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash
Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, Low Power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, Low Power Timer, Real-Time Clock
Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100
Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash
Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option
