Texas Instruments has introduced the ADC34DSO75, a 3 gigasamples per second (GSPS) analog-to-digital converter (ADC) for 24/7, low-power, event-based remote monitoring of AI data center power rails at nanosecond resolution.
As AI workloads increase, data center operators face power instability, inadequate real-time monitoring and signal degradation, which can lead to costly downtime. TI says existing monitoring solutions can miss nanosecond-level power-rail glitches that cause unplanned outages.
The ADC34DSO75 combines ultra-high-speed sampling with on-chip digital signal processing to detect and capture transient fault events in real time. TI says it enables remote, event-based telemetry and continuous, high-resolution monitoring of low-voltage, high-current power rails, without on-site debugging and oscilloscopes. The company describes it as the industry's highest performance 3 GSPS ADC and says it provides monitoring thousands of times faster than current solutions.
TI also announced the LMI800PS, an 800V isolated hot-swap controller that replaces a five-integrated-circuit discrete solution with a single high-density package. Its integrated isolated bias supply and PMBus telemetry reduce board area by more than 60%; the device provides in-rush current and power path protection, 5kVrms reinforced isolation and more than 8mm creepage. It supports both ±400V and 800V distributions.
The LMK6B is a bulk acoustic wave (BAW)-based oscillator with a stated jitter performance of 9.6fs at 625MHz. TI says the oscillator also provides power-supply rejection ratio (PSRR) performance for data center transmission rates approaching 3.2Tbps.
Karthik Vasanth, vice president and general manager for TI's Data, Converters and Clocks business unit, said: “As AI workloads drive massive scale, the need for real-time visibility and architectural stability has never been greater. By delivering industry-leading solutions for high-speed telemetry, advanced power protection and precision timing, TI is enabling hyperscalers and operators to design the next generation of AI data centers with optimized performance and minimal downtime.”
TI is demonstrating the products at the Open Compute Project (OCP) Global Summit, booth No. E45. The company will also showcase 800VDC power solutions on NVIDIA's MGX AI Factory Ecosystem wall. TI Power Electronics Engineer David Reusch will present “800V Data Center DC/DC Design Considerations, Topology Comparisons and Trade-Offs” on Oct. 15 at 2:45 p.m. in room 230A.
