Dymax Introduces 9310 Adhesive for Reinforcing PCB Components

Dymax, a manufacturer of light-curing materials and equipment, has launched a new adhesive called 9310, designed to reinforce small, closely spaced, leadless components on printed circuit boards, the kind of tiny surface-mount parts increasingly common in advanced electronics and AI hardware.

The adhesive is built to cure with light in a matter of seconds, offering a faster alternative to traditional underfill, the material typically used to fill the gap beneath a chip and anchor it to the board. A secondary heat cure step follows to ensure the adhesive fully hardens even in shadowed spots that light can't reach directly, helping it perform consistently across complex board assemblies.

Once cured, 9310 is designed to hold its bond through high-temperature reflow, the soldering process used to attach components to a board. It's also formulated to flex under strain, which helps it absorb the movement components go through as they expand and contract with temperature changes, reducing stress on solder joints and the components themselves. That flexibility comes from a combination of high elongation, meaning it can stretch significantly (up to 145%) before breaking, and a controlled modulus, a measure of how stiff or flexible the material is, letting it accommodate both thermal and mechanical strain while keeping the bond intact over time.

The adhesive also ...