Manz Asia Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System for AI and HPC Applications

Manz Asia has delivered the world's first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) mass production system to a customer production line. The system is part of the Omni x-series covering 310mm, 510mm, and 700mm platforms.

The ECD platform supports both glass and metal square carriers and integrates wet chemical process modules for Redistribution Layer (RDL) fabrication. It is engineered for FOPLP-, CoPoS-, and TGV-based advanced packaging architectures and supports FOPLP, CoPoS, and TGV applications for AI, HPC, and advanced memory markets.

The 310mm × 310mm format offers advantages in scalability, panel utilization, and production yield for panel-level packaging applications supporting AI, high-performance computing (HPC), high-bandwidth memory (HBM), and high-speed interconnect uses.

The system integrates a full suite of wet chemical process modules, including cleaning, developing, etching, and stripping, and supports both spin and spray processing modes. This forms a comprehensive 310mm × 310mm panel-level RDL manufacturing solution under the Omni 310x platform.

The Omni x-series includes Omni 310x (310mm × 310mm), Omni 510x (510mm × 515mm), and Omni 700x (700mm × 700mm). The modular system design enables flexible configuration across different device architectures, process fl...