STMicroelectronics has announced the VL53L9, its first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module. The module provides 2,268 resolution zones (54×42) and is designed for high-resolution spatial awareness in compact edge AI systems. The VL53L9 offers a wide 54°×42° field of view, on-chip processing, a frame rate of up to 100 frames per second, and a sensing range from 5 centimeters to 9 meters. It targets applications in robotics, industrial automation, smart buildings, AR/VR, and healthcare.
The module combines high-resolution depth data with a fully integrated architecture in a single compact package measuring 12.8 mm × 6.1 mm × 4.6 mm. It uses ST’s proprietary stacked BSI SPAD sensor technology and metasurface optical elements (MOE). Dual-scan flood illumination replaces traditional dot scanning, which reduces motion artifacts, eliminates dead zones, and supports capture of both 2D infrared and 3D depth images.
The VL53L9 integrates on-chip dToF processing and a dedicated power management IC. It is calibration-free, reflowable, and compatible with a wide range of cover glass materials. It supports dual power supply operation (1.2 V and 3.3 V) and provides data output via MIPI or I3C interfaces. The module is certified as Class 1 laser safe and is intended for low-compute edge AI systems on small microcontrollers.
“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.
Market analyst Anas Chalak from Yole Group noted the broader context: “3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption.”
Specified Use Cases
Robotics: Enhanced small object detection, SLAM (simultaneous localization and mapping), and obstacle avoidance for autonomous navigation.
Industrial automation: Accurate volume measurement in tanks and bins for operational efficiency and inventory management.
Smart buildings and homes: Reliable human presence detection and people counting while preserving user privacy.
AR/VR and consumer electronics: Advanced gesture recognition, body tracking, and finger skeleton for immersive user experiences.
Healthcare: Fall detection and monitoring solutions for eldercare and patient safety.
The ST FlightSense VL53L9 is scheduled to enter mass production in early July 2026, with samples and volume shipments available to customers globally.
