Cadence Announces Chiplet Spec-to-Packaged Parts Ecosystem

Cadence  announced a Chiplet Spec-to-Packaged Parts ecosystem targeting chiplet development for physical AI, data center, and high-performance computing applications.

Initial IP partners include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with proteanTecs as silicon analytics partner.

Cadence is collaborating with Samsung Foundry on a silicon prototype demonstration of the Cadence Physical AI chiplet platform, incorporating pre-integrated partner IP on the Samsung Foundry SF5A process.

Cadence and Arm are extending collaboration to integrate Arm Zena Compute Subsystem and other IP into the Cadence Physical AI chiplet platform and Chiplet Framework for edge AI processing in automobiles, robotics, and drones, as well as standards-based I/O and memory chiplets for data center, cloud, and HPC applications.

David Glasco, vice president of the Compute Solutions Group at Cadence, stated that the ecosystem addresses multi-die and chiplet-based architectures for performance and cost efficiency amid design complexity. Cadence solutions use pre-integrated and pre-validated IP from partners.

The ecosystem features spec-driven automation to generate chiplet framework architectures combining Cadence IP and third-par...