India's First Advanced 3D Semiconductor Packaging Unit: Foundation Stone Laid in Odisha

The foundation stone for the country’s first advanced 3D chip packaging unit was laid at Info Valley, Bhubaneswar. The Heterogeneous Integration Packaging Solutions project is promoted by 3D Glass Solutions. The foundation stone was laid in the presence of Chief Minister Mohan Charan Majhi and Union Minister for Railways, Electronics & Information Technology, and Information & Broadcasting Ashwini Vaishnaw.

Chief Minister Mohan Charan Majhi described the project as a historic milestone for Odisha and the nation. He said that for the first time in India, an advanced 3D Glass Solutions semiconductor project is being established. He noted that global technology leaders such as Intel, Lockheed Martin, and Applied Materials are associated with cutting-edge packaging technologies, and their interest in Odisha reflects the state’s growing industrial strength.

The Chief Minister said that the products manufactured in the state will support next-generation sectors such as Artificial Intelligence, high-performance computing, defence electronics, telecommunications, and advanced digital systems. He added that Odisha is ready to play a pivotal role in realising Prime Minister Narendra Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing.

He informed that the company is investing nearly ₹2,000 crore in th...