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Tessolve Appoints Ravi Kumar Chirugudu as President and COO

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Tessolve announced the appointment of Ravi Kumar Chirugudu as President and Chief Operating Officer, effective April 6, 2026. Chirugudu brings over 35 years of experience in silicon, systems, embedded software, and product development. He previously held senior leadership roles at HCL Technologies, Altran, and Wipro, managing large P&L portfolios, and began his career as a scientist at ISRO working on CCD development and satellite payloads. He has contributed to the launch of over 1,000 new products across high-tech, energy, and manufacturing sectors.

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In his new role, Chirugudu will lead Tessolve’s growth strategy, focusing on expanding global engineering capabilities, deepening customer relationships, and accelerating innovation in semiconductor and high-performance computing domains. He will also support building cross-functional, cross-regional teams.

The appointment follows Tessolve’s acquisition of German-based Dream Chip Technologies and its US$150 million funding from TPG. Tessolve operates as a provider of system and silicon solutions, partnering with 18 of the world’s top 20 semiconductor companies. The company employs over 3,500 engineers across 12 countries, including India, the US, Germany, the UK, Singapore, and Malaysia.

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Srini Chinamilli, Co-founder and CEO of Tessolve, stated that the move supports scaling global semiconductor and system engineering capabilities amid rising industry demand across design, packaging, validation, and systems integration. Chirugudu noted the industry’s shift toward complex, AI-driven systems and highlighted Tessolve’s people-first culture and expertise in semiconductor innovation.


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