Intel Joins Terafab Project with Tesla, SpaceX, and xAI for Semiconductor Fabrication, Logic, Memory, and Packaging

Intel announced on X its participation in the Terafab project with SpaceX, xAI, and Tesla to help refactor silicon fab technology. The company stated that its ability to design, fabricate, and package ultra-high-performance chips at scale will help accelerate Terafab’s aim to produce 1 TW/year of compute to power future advances in AI and robotics. The post also noted that Intel hosted Elon Musk at its facilities this past weekend.

Terafab was originally launched by Tesla, SpaceX, and xAI in March 2026. It aims to scale to 1 TW/year of compute capacity for AI and robotics, with Intel now supplying process tech, design, fabrication, and advanced packaging.

In a separate post on X, Intel CEO Lip-Bu Tan stated: “Elon has a proven track record of reimagining entire industries. This is exactly what is needed in semiconductor manufacturing today. Terafab represents a step change in how silicon logic, memory and packaging will get built in the future. Intel is proud to be a partner and work closely with Elon on this highly strategic project ”

Elon has a proven track record of reimagining entire industries. This is exactly what is needed in semiconductor manufacturing today. Terafab represents a step change in how silicon logic, memory and packaging will get built in the future. Intel is pr...