Prime Minister Narendra Modi inaugurated the Kaynes Semicon plant at Sanand, Gujarat, on today March 31, 2026. The event marked the commencement of commercial production at the outsourced semiconductor assembly and test (OSAT) facility.
The facility was constructed in a record 14 months following groundbreaking in January 2025. The first multichip module was produced in October 2025.
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The plant features 18,000 square meters of clean room space across Class 1K, 10K, and 100K categories, along with more than 1,200 production equipment units. It has an annual production capacity of 2.3 billion chips.
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Supported packaging types include WLCSP, FlipChip, SiP, MCM, and wire bond packages. The chips are intended for applications in defense and aerospace, industrial, automotive, consumer, medical, and other sectors. This development forms part of India's semiconductor manufacturing initiatives, with the Sanand facility emerging as a key site in the sector.
