Camtek Secures $31 Million OSAT Order for AI Packaging as Q1 2026 Bookings Top $90 Million

Camtek announced that it has received a multi-system order valued at $31 million from a leading outsourced semiconductor assembly and test (OSAT) provider. The order is mainly for CoWoS-like advanced packaging applications supporting AI. Including this order, total orders from leading OSATs in the first quarter of 2026 have exceeded $90 million, with the majority allocated to similar AI-related applications. The systems are scheduled for delivery within 2026.

 

Separately, Camtek announced a $25 million order for multiple Hawk systems from a tier-1 integrated device manufacturer (IDM) for AI applications. This follows a series of smaller repeating orders from the same IDM, bringing the total aggregate value of Hawk orders from this customer to $45 million, also scheduled for delivery in 2026.

 

The Hawk platform is Camtek’s latest inspection and metrology system, designed for advanced packaging applications such as High Bandwidth Memory (HBM), chiplets, hybrid bonding, front-end (FE) processes, and wafers with up to 500 million micro-bumps. It features enhanced capabilities, throughput, and precision.

 

Camtek develops and manufactures high-end inspection and metrology equipment for the semiconductor industry. Its systems inspect and measure wafers throughout the production process, cove...