From Chiplets to Co-Packaged Optics: Caliber Executive Highlights India’s Rising Role in Advanced Semiconductor Packaging & Testing

India's semiconductor ecosystem is gaining momentum with domestic OSAT and ATMP facilities leading the way, enabling faster time-to-market and leveraging longstanding post-silicon expertise, according to Gowrisankar Arumugasamy, Director of Engineering at Caliber Interconnect Solutions.

In an in-depth interview with Srinivasa Reddy N. Editor of  EEHerald, Mr. Arumugasamy emphasized that establishing OSAT (Outsourced Semiconductor Assembly and Test) and ATMP (Assembly, Testing, Marking, and Packaging) infrastructure should precede full fab operations. "You get the fab functional, you get the silicon out, but if you do not have a packaging facility or making it as an IC accessible to the market, there is no point in having a FAB," he stated. He praised India's strategic approach, noting that the country is "on the right track" by prioritizing these back-end capabilities.

Pic: Gowrisankar Arumugasamy

India has provided post-silicon validation and testing services for over two decades, forming part of the global supply chain. Previously, high-volume manufacturing occurred overseas (often in Taiwan for TSMC-produced chips), with Indian teams handling engineering bring-up and characterization ...