75% of the World’s Semiconductor Chips Are 28nm–90nm; Here’s Why India Is Finally Making Them at Home

India's Design Linked Incentive (DLI) Scheme, a key component of the Semicon India Programme led by the Ministry of Electronics and Information Technology (MeitY), continues to drive domestic semiconductor design innovation. As of January 2026, the scheme has approved 24 chip design projects under its Product Design Linked Incentive (PDLI) component, providing direct financial support to Indian companies, startups, and MSMEs for developing Integrated Circuits (ICs), Chipsets, System-on-Chips (SoCs), and related IP cores.

Complementing the design ecosystem, India's front-end and back-end manufacturing is accelerating: The Tata-PSMC fab in Dholera, Gujarat (India's first major semiconductor fabrication facility), is on track for completion and trial production readiness by 2027-28, with initial wafers expected around that timeline. Additionally, nine approved OSAT (Outsourced Semiconductor Assembly and Test) / ATMP facilities are progressing rapidly, with several (including Micron, CG Power, Kaynes Semicon, and Tata Electronics in Assam) initiating or completing pilot lines in 2025 and gearing up for full commercial production starting in 2026.

In a NDTV interview by Rahul Kanwal at the World Economic Forum in Davos in this month of Jan 2026, with IBM CEO Arvind Krishna, Union Minister Ashwini Vaishnaw explained India's pragmatic semiconductor manufacturing strat...