CES 2026: Qualcomm Announces Snapdragon Digital Chassis Updates, Agentic AI Collaborations, Dragonwing Processors and Snapdragon X2 Plus Platform

Qualcomm Technologies presented multiple announcements at CES 2026 focused on automotive, IoT, robotics, and computing platforms.

In automotive, Qualcomm expanded its collaboration with Google to integrate Snapdragon Digital Chassis solutions with Google's automotive software, including Android Automotive OS and Gemini Enterprise for Automotive, supporting agentic AI, cloud connectivity, unified reference platforms, AAOS SDV scaling, Snapdragon vSoC on Google Cloud, and Project Treble for lifecycle management across four generations of Snapdragon Cockpit Platforms.

Snapdragon Cockpit Elite and Ride Elite platforms gained collaborations with Li Auto, Leapmotor, Zeekr, GreatWall Motor, NIO, Chery, and Garmin, reaching 10 design wins. Leapmotor introduced a central computer using dual SA8797P platforms for its D19 model, unifying cockpit, driver assistance, body control, and connectivity, supporting up to eight displays, 18-channel audio, OTA updates, up to 13 cameras, and L2 assistance features.

Snapdragon Ride Flex SoC, unifying digital cockpit and ADAS, is deployed in eight global progr...