Murata Begins Mass Production of ULTICIRC Inner-Cavity LCP Flexible Substrate with Dk Below 2.0 for 6G Applications

Murata has started mass production of ULTICIRC, a liquid crystal polymer (LCP) flexible substrate that incorporates an inner cavity structure.

The inner cavity design achieves a dielectric constant (Dk) below 2.0 and reduces transmission loss compared to conventional flexible substrates.

The substrate is intended for use in the FR3 frequency band (7–24 GHz) expected for 6G communications. It supports thin profiles while maintaining low transmission loss, addressing the trade-off seen in conventional flexible substrates where thinner construction increased loss.

ULTICIRC builds on Murata’s existing LCP flexible substrate technology, which uses a proprietary high-performance resin and an adhesive-free one-shot press multilayer lamination process.