India Semiconductor Push 2025: 122 Chip Designs Taped Out, 28 Student Chips Handed Over Under C2S Programme at SCL Mohali

Union Minister for Electronics & Information Technology, Ashwini Vaishnaw, on 28 November 2025 visited Semiconductor Laboratory (SCL), Mohali, and handed over 28 chips fabricated at SCL (including 600 bare dies and 600 packaged chips) to representatives of 17 academic institutions under the Chips to Start-up (C2S) Programme.

During the visit, the Minister reviewed ongoing modernisation activities at SCL and attended a ceremony where the chips, designed by students, were formally delivered.

The Government of India is providing Indian universities and institutions access to industry-grade Electronic Design Automation (EDA) tools and Multi-Project Wafer (MPW) fabrication services through the ChipIN Centre and SCL under the C2S Programme.

Key recorded statistics in the past one year (December 2024 – November 2025):

- 122 design tapeouts submitted by 46 institutions across India  
- 5 MPW shuttle runs organised by ChipIN Centre for fabrication at SCL Mohali using 180 nm technology  
- 56 student-designed chips successfully fabricated and delivered so far  

Shuttle-wise break-up:  
1. MPW Shuttle-I – Tape-out 06 Dec 2024 – 20 designs, 17 institutions