AI-Driven Advanced Packaging: Polymeric Materials Market to Reach $3.3 Billion by 2030 at 13.2% CAGR

Yole Group released its technology and market report, "Polymeric Materials for Advanced Packaging 2025", which analyzes the role of polymers in semiconductor packaging amid AI and high-performance computing developments.

The polymeric materials market for advanced packaging is projected to grow from 2025 to 2030 at a 13.2% compound annual growth rate, reaching $3.3 billion. Mobile and consumer electronics represent the largest segment, expected to hit approximately $2.14 billion by 2030 with an 11% CAGR. Telecom and infrastructure segments are expanding at a 19% CAGR, driven by AI and data center applications. Automotive, industrial, medical, and defense segments show smaller but steady growth due to high-reliability requirements.

System-in-Package (SiP) leads in volume for polymeric materials usage. The 2.5D and 3D packaging categories exhibit the strongest growth rates, applied in AI, mobile, PC, and ADAS systems. Larger package sizes and integration of architectures such as CoWoS, PLP, HBM, and CPO increase demand for materials with thermal and mechanical properties.

The report covers dielectrics, mold compounds, underfill, and temporary bonding materials. Dielectrics are forecast to nearly double to $729 million by 2...