MosChip Partners with EMASS on 22nm Silicon Implementation for ECS-DoT Ultra-Low-Power Edge AI SoC

MosChip Technologies announced its collaboration with EMASS on the silicon implementation of the ECS-DoT Edge AI System-on-Chip (SoC), a RISC-V-based ultra-low-power chip targeted at wearables, drones, industrial IoT, and edge sensors.

EMASS led the architecture design of the ECS-DoT, which integrates dual neural accelerators and 4MB of on-chip memory. The SoC is designed for real-time, milliwatt-class AI inference in vision, audio, and sensor workloads without requiring cloud connectivity. EMASS set performance targets of up to 93% faster processing and 90% lower energy consumption compared to conventional edge AI solutions.

MosChip provided silicon and product engineering services in 22nm technology, including physical design flows, tape-out coordination, packaging, assembly, evaluation hardware development, and validation activities. The partnership resulted in a fully functional SoC and evaluation platform delivered to OEM partners.

Mark Goranson, CEO at EMASS, stated: “MosChip played an important role in supporting the silicon implementation of our architecture. Their contributions in physical design, product engineering, and validation complemented our internal efforts and helped us bring a robust SoC to our OEM partners.”

Srinivasa Rao Kakumanu, CEO & Managing Director at MosChip Technologies, said: “EMASS defined a hi...