GlobalFoundries Silicon Labs Partnership Targets 40nm Ultra Low Power Wireless SoCs for U.S. IoT Manufacturing

GlobalFoundries and Silicon Labs have expanded their strategic partnership to develop next-generation energy-efficient wireless technologies using GF’s 40nm Ultra Low Power platform at its Malta, New York facility.

Silicon Labs wireless system-on-chips will be manufactured on the 40ULP-ESF3 platform, introduced this fall at GF’s Global Technology Summit in Silicon Valley. The platform incorporates embedded SuperFlash technology, ultra-low standby leakage devices, high endurance, and integrated analog features for secure, battery-powered IoT edge applications requiring always-on functionality, data security, and energy efficiency.

Matt Johnson, President and CEO of Silicon Labs, stated the collaboration addresses demand for Series 2 products and strengthens global supply chain resilience through U.S. manufacturing.

Tim Breen, CEO of GlobalFoundries, said the partnership delivers secure, power-efficient solutions for smart consumer and industrial devices using the New York fab.

The partnership focuses on consumer and industrial IoT applications for advanced wireless connectivity. Development is underway, with production ramping over the next several years.