Semiconductor Foundry

GlobalFoundries, Infineon Join imec Automotive Chiplet Program with Chiplet Adoption Trends

GlobalFoundries has joined imec’s Automotive Chiplet Program (ACP) as a foundry partner, marking the first foundry and suppliers to sign the program. Semiconductor and system companies Infineon, Silicon Box, STATS ChipPAC, and Japanese autonomous driving technology developer TIER IV have also committed to join ACP.

This expands imec’s network and accelerates the development and adoption of a chiplet architecture for the automotive industry.

Vehicles are evolving into high-performance, software-defined platforms. Traditional monolithic chip designs face challenges in meeting demands of advanced driver assistance systems (ADAS), autonomous driving, and in-vehicle infotainment. Chiplet architectures provide a scalable, flexible, and cost-effective alternative for integration into software-defined vehicle compute systems.

Imec’s ACP unites stakeholders from the automotive and semiconductor ecosystems in a pre-competitive research initiative. The program focuses on accelerating chiplet architectures and packaging technologies for next-generation vehicles, ensuring compliance with automotive-grade safety and reliability requirements.

GlobalFoundries will supply advanced manufacturing capabilities, a technology portfolio, and fabs in the U.S., Europe, and Asia for developing and manufacturing ACP’s chiplet-based platforms.

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