Arteris Bolsters AI Chip Design with New FlexGen IP and Strategic AMD Partnership

Arteris,  a provider of system IP for chiplet and system-on-chip (SoC) development, announced expansions to its Multi-Die solution, the release of Magillem Packaging software, and a licensing agreement with AMD for its FlexGen interconnect IP. These developments follow strong Q2 earnings and align with the company’s participation at the AI Infra Summit 2025 in Santa Clara, California, from September 9-11.

The FlexGen smart Network-on-Chip (NoC) IP uses automation to design interconnects, reducing manual adjustments and accelerating chip design by 10x, cutting iterations from weeks to days. It employs AI-driven heuristics to achieve up to 30% reduction in wire length, lowering power consumption and latency. AMD has licensed FlexGen for data transport in its chiplets across data center, edge, and end-device products. Renesas also adopted Arteris’ multi-die technology for its R-Car Gen 5 SoC platform, supporting advanced driver-assistance systems with CPUs, AI-enabled NPUs, IVI-enabled GPUs, and chiplet extensions for enhanced AI throughput.

Arteris’ technology is integrated into over 3.85 billion units across automotive, enterprise computing, consumer electronics, communications, and industrial markets. Th...