Four more India Semiconductor Projects approved: SiCSem and 3D Glass Solutions in Odisha, CDIL in Punjab and ASIP Semiconductor in AP

The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four semiconductor projects under the India Semiconductor Mission (ISM). Six semiconductor projects have already been approved and are in various stages of execution. The four new proposals involve SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.

These projects will establish semiconductor manufacturing facilities with a cumulative investment of Rs 4,600 crore. They are projected to generate employment for 2034 skilled professionals and contribute to the creation of indirect jobs in the electronic manufacturing ecosystem. Following these approvals, the total number of approved projects under ISM stands at 10, with cumulative investments of Rs 1.60 lakh crore across six states.

The projects address demand in sectors including telecom, automotive, data centers, consumer electronics, and industrial electronics.

SiCSem and 3D Glass Solutions Inc. will be located in Odisha. CDIL is based in Punjab, and ASIP will be established in Andhra Pradesh.

SiCSem Private Limited, in collaboration with Clas-SiC Wafer Fab Ltd. from the UK, will set up an integrated f...