Point2 Technology and Foxconn Interconnect Technology Collaborate on AI Cluster Scalability with Terabit-Speed e-Tube Solutions

Point2 Technology, a provider of low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnects, and Foxconn Interconnect Technology (FIT), a precision interconnect solutions provider, have signed a Memorandum of Understanding (MOU) to develop and commercialize Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions. The partnership focuses on addressing the demand for high-performance interconnects in hyperscale data centers for AI cluster scalability.

The collaboration will produce MSA-compliant 1.6T and 3.2T pluggable ARCs using Point2’s UltraWave RF Transmitter and Receiver SoCs, alongside co-developed NPE solutions for in-rack, cross-rack, and switch-to-NIC connectivity. Point2’s e-Tube technology, utilizing RF transmission over plastic waveguide, extends transmission reach 10 times beyond copper at similar costs, with three times lower power consumption and 1,000 times reduced latency compared to optical interconnects.

Sean Park, CEO of Point2 Technology, stated that the partnership aims to establish e-Tube as a key interconnect for AI-driven workloads, addressing limitations of copper and optical solutions. Julia Jiang, VP of Marketing and Sales at FIT Electronics, noted that the collaboration will support data centers in scaling AI workloads across multiple generations.

Point2 and FIT plan to engage in joint...