CoAsia SEMI and Rebellions Partner to Develop Next-Generation AI Chiplet for Data Centers by 2026

CoAsia SEMI, a system semiconductor design specialist and subsidiary of CoAsia, has entered into a strategic partnership with Rebellions, a South Korean AI semiconductor company, to develop AI chiplets and software solutions for data centers. The collaboration focuses on Rebellions’ next-generation AI chiplet, REBEL, utilizing CoAsia SEMI’s advanced packaging technologies.

On July 22, a signing ceremony at Rebellions’ headquarters formalized the agreement, attended by CoAsia SEMI CEO DS Shin, Rebellions CEO Sung Hyun Park, and CoAsia Group Chairman Lee Hee-jun. The partnership aims to build a global AI ecosystem, following an earlier collaboration in April to secure a national project for a multi-petaflops Processing-In-Memory (PIM) server chiplet.

The new agreement advances the commercialization of data center products, leveraging CoAsia SEMI’s expertise in 2.5D silicon interposer, advanced packaging, and manufacturing technologies. The chiplet-based design, compared to traditional single SoC architectures, provides enhanced design flexibility, yield, and power and performance optimization, positioning it as a key technology for AI and high-performance computing (HPC) servers.

The collaboration involves developing a heterogeneous chiplet-based product integrating the REBEL architecture with I/O dies and HBM3E memory, expanding th...