IPC opens call for abstracts for IPC APEX EXPO 2026 technical conference and professional development courses

IPC announced it is accepting abstracts for technical papers, posters, and professional development courses for IPC APEX EXPO 2026. The event, featuring the renamed Advanced Electronic Packaging Conference 2026: Component- to System-Level Integration, will occur March 17-19, 2026, with professional development courses scheduled for March 15-16 and March 19, 2026, at the Anaheim Convention Center in Anaheim, California.
The technical conference will cover topics including design and simulation, materials, advanced PCB fabrication, assembly, test and manufacturing, quality, reliability and metrology, digital manufacturing, and sustainability. IPC encourages technologists to submit an early indication of interest by July 31, 2025, through the abstract submission portal to secure session slots. Technical paper abstracts are due by September 12, 2025, and technical poster abstracts by December 1, 2025. Submissions must be non-commercial, summarizing original, previously unpublished work such as research experiments, new techniques, materials, or industry trends and challenges. Papers will be published in a proceedings document, and both papers and posters will be presented in person. Posters will be displayed on the exhibit floor with dedicated networking sessions, and authors will receive guidance on formatting, printing, and displaying.
The Technical Program Committee wil...