Mixx Advanced 3DS Platform optimizes Co-Packaged Optics for AI infrastructure scalability

Mixx Technologies,  a new optical interconnect solutions startup founded by Vivek Raghuraman and Rebecca K. Schaevitz has recently unveiled its Advanced 3DS Platform  at the OFC 2025 Conference in San Francisco, aims to address connectivity challenges in AI and high-performance computing (HPC) infrastructure.

The Advanced 3DS Platform consists of three components: an intelligent Engine that unifies compute, memory, and network functions; a Package that integrates the Engine with core ASICs for high-speed connectivity; and a System offering exaflop-scale computing with petabit end-to-end connectivity for rack-scale compute. The platform uses silicon-integrated optics to provide non-blocking, energy-efficient data movement, supporting real-time inference and large-scale AI training through multi-petabit interfaces with low latency and high throughput. It integrates with advanced ASICs to reduce network complexity and ensure continuous operation for dynamic AI workloads, while maintaining compatibility with industry standards.

Mixx Technologies' Advanced 3DS Platform plays a significant role in co-packaged optics. The platform integrates siliconized optical interconnects with advanced ASICs to create a high-performance con...