Intel Foundry: Ready, steady, go with TSMC! 18A in risk production

At the Intel Foundry Direct Connect event held on 29th Apr 2025, Intel Foundry outlined advancements in its semiconductor process technology, advanced packaging, manufacturing capabilities, and ecosystem partnerships. The event featured keynotes from Intel CEO Lip-Bu Tan, Chief Technology and Operations Officer Naga Chandrasekaran, and General Manager of Foundry Services Kevin O’Buckley. Industry executives from Synopsys, Cadence, Siemens EDA, PDF Solutions, MediaTek, Microsoft, and Qualcomm also participated.

Process Technology Developments
Intel Foundry has engaged lead semiconductor-foundry customers on its Intel 14A process, the successor to Intel 18A, and distributed an early Intel 14A Process Design Kit (PDK). Multiple customers plan to build test chips on this node. Intel 14A includes PowerDirect contact power delivery, building on the PowerVia technology in Intel 18A.  
Intel 18A is in risk production and slated for volume manufacturing in 2025. Ecosystem partners have electronic design automation (EDA) enablement, reference flows, and intellectual property (IP) ready for production designs. A new variant, Intel 18A-P, targets a broader customer base, with early wafers in fabrication. Intel 18...