World semiconductor fab forecast by SEMI: 18 new construction projects in 2025

US based semiconductor equipment industry body SEMI reported 18 new fab construction projects to start in year 2025. The new projects include three 200mm and fifteen 300mm facilities, the majority of which are expected to begin operations from 2026 to 2027. SEMI excluds R&D fabs from the list. In 2025, the Americas and Japan are the leading regions with four projects each. The China and Europe & Middle East regions are each tied for third place with three planned construction projects. Taiwan has two planned projects, while Korea and Southeast Asia have one project each for 2025.
“The semiconductor industry has reached a pivotal juncture, with investments driving both leading-edge and mainstream technologies to meet evolving global demands,” said Ajit Manocha, SEMI President and CEO. “Generative AI and high-performance computing are fueling advancements in the leading-edge logic and memory segments, while mainstream nodes continue to underpin critical applications in automotive, IoT and power electronics. The construction of 18 new semiconductor fabs set to begin in 2025 demonstrates the industry’s commitment to support innovation and significant economic growth.” Here are the more details shared by SEMI in its release: Covering 2023 to 2025, the 4Q 2024 edition of Wor...