Alchip opens 3D semiconductor design services for ASICs

Taiwan based Alchip announced opening of its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications. 3DIC design refers to a cutting-edge semiconductor technology where multiple integrated circuits (ICs) are stacked vertically within a single package. This approach uses through-silicon vias (TSVs) and hybrid bonding to integrate the stacked chips, enabling faster data transfer, reduced power consumption, and a smaller footprint compared to traditional two-dimensional designs. Future designs for these applications will require high performance and efficiency in cloud and networking infrastructure, mobile devices, and graphics processing units (GPUs). Alchip’s silicon-proven 3DIC design flow has optimized selected 3DIC designs along three critical dimensions: power delivery, die-to-die electrical interconnect, and system-wide thermal characterization. The new 3DIC design flow’s power delivery module encompasses power integrity, power grid design (including through-silicon-via distribution), and power integrity simulation and sign-off capabilities. Die-to-die electrical interconnect capabilities identify and rectify low clock skew across dies, process variation immunity, noise immunity, data transmission across different power domains, and inter-die setup/hold timi...