Advanced IC substrate market: CAGR of 9% to reach US$25.53 billion by 2029

Yole reported that the advanced IC substrate market currently dominated by organic core substrates, saw revenue decline in 2023, marking a year of correction. Further findings shared by Yole includes: However, starting in 2024, the industry is poised for growth, with an expected CAGR of 9% projected to bring the market to US$25.53 billion by 2029. This growth will largely be driven by the rising demand for FC BGA substrates for FCBGA and 2.5D/3D advanced packages, fueled by AI accelerators for HPC and data centers, 5G, AI PC CPU s, XPUs, and automotive sectors. The competition to commercialize glass core substrates is heating up, with numerous players entering the fray, striving to lead in GCS -based product commercialization. Leading companies like Absolics, Intel, and Samsung are at the forefront, backed by an extensive network of equipment, material, and glass suppliers in their sub-supply chains. Exciting advancements are expected in the realm of glass core substrates. In this regard, do not miss the chance to read the Glass to enable next-gen IC substrates – An interview with Absolics by Yole Group! In addition to its quarterly Advanced Packaging Market Monitor, and its Status of the Advanced Packaging Industry, Yole Group released its new annual Status of the Advanced IC Substrate Industry 2024 report. With this study, the market research and strategy consulting ...