TrendForce: Demand from AMD and NVIDIA drives TSMC FOPLP development

Demand from AMD and NVIDIA drives FOPLP development, Mass production expected in 2027–2028, Says TrendForce. In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions. Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main models for introducing FOPLP packaging technology: Firstly, OSAT providers transitioning from traditional methods of consumer IC packaging to FOPLP. Secondly, foundries and OSAT providers packaging AI GPUs that are transitioning 2.5D packaging from wafer level to panel level. Thirdly, panel makers who are packaging consumer ICs. Examining cases of OSAT providers transitioning from traditional packaging to FOPLP for consumer ICs, AMD has been in in discussion with PTI and ASE for PC CPU products, while Qualcomm has been in talks with ASE for PMIC products. Currently, due to FOPLP’s linewidth and spacing not yet matching the level of FOWLP, FOPLP applications are temporarily limited to mature processes and cost-sensitive products ...