PM lays foundation for first India's volume semiconductor fab
In a digitally broadcasted event with virtual attendance of Lakhs of students from 60 thousand colleges, key stakeholders and tech enthusiasts all around India, Prime Minister Narendra Modi lays foundation for 3 semiconductor facilities in India. They are:
1. 28nm Semiconductor Fab with 50,000 wfsm capacity by Tata Electronics in partnership with Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan in Dholera, Gujarat.
2. Semiconductor ATMP unit in Assam by Tata Semiconductor Assembly and Test Pvt Ltd in Morigaon, Assam.
3. Semiconductor ATMP unit for specialized chips by CG Power, in partnership with Renesas Electronics, Japan and Stars Microelectronics, Thailand in Sanand, Gujarat.
Calling it a historic day, He said "Semiconductor facilities in Dholera and Sanand in Gujarat, Semiconductor facilities in Morigaon in Assam, these will help in making India a big global hub of semiconductor manufacturing. During the first, second and third industrial revolutions, India was left behind due to many reasons. But now India is moving forward with confidence with the intention of leading Industry 4.0, the fourth industrial revolution. We don't want to lose even a moment. And today's program is also an example of how fast we are working in this direction. We are moving on the pat...
Calling it a historic day, He said "Semiconductor facilities in Dholera and Sanand in Gujarat, Semiconductor facilities in Morigaon in Assam, these will help in making India a big global hub of semiconductor manufacturing. During the first, second and third industrial revolutions, India was left behind due to many reasons. But now India is moving forward with confidence with the intention of leading Industry 4.0, the fourth industrial revolution. We don't want to lose even a moment. And today's program is also an example of how fast we are working in this direction. We are moving on the pat...
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